P39. Nobuyuki Shishido, Toru Ikeda, Noriyuki Miyazaki, Strain Measurement in The Microstructure of Advanced Electronic Packages Using Digital Image Correlation, Proceedings of EMAP 2005, Tokyo, pp. 83-87, 2005.

P38. Toru Ikeda, Won-Keun Kim and Noriyuki Miyazaki, Reliability of a Flip Chip using Adhesive Interconnection under Solder Reflow Process, Proceedings of ICCES 2005, Chennai India, pp.2384-2389, 2005.

P37. Toru Ikeda, Won Keun-Kim and Noriyuki Miyazaki, Predicting Technique of Delamination at Adhesively Bonding Joints in an Flip Chip Package during Solder Reflow Process, Proceedings CD-ROM of ASME InterPACK 2005, IPACK-75153, pp. 1-9, 2005.

P36. Masaki Koganemaru, Toru Ikeda and Noriyuki Miyazaki, Experimental and Numerical Evaluation of Residual Stress in IC Chips, Proceedings CD-ROM of ASME InterPACK 2005, IPACK2005-73110, pp. 1-6, 2005.

P35. Toru Ikeda, Won-Keun Kim, Masaki Nagai and Noriyuki Miyazaki, Reliability Evaluation of Interconnection Using Anisotropic Conductive Adhesive Films (Effects of ACF Resins, Substrates and Bump-Heights), Proceedings of the 6th International Conference on Electronics Materials and Packaging (EMAP 2004), pp. 488-493, 2004.

P34. Won-Keun Kim, Toru Ikeda and Noriyuki Miyazaki, Mechanical Reliability of Anisotropic Conductive Adhesive Films under Moisture/Reflow Sensitivity Test, Proceedings CD-ROM of the Sixth World Congress on Computational Mechanics in conjunction with the Second Asian-Pacific Congress on Computational Mechanics, R501, pp. 1-10, 2004.

P33. Toru Ikeda, Junji Mano and Noriyuki Miyazaki, Damage Analysis of a Crack in a Thin Adhesive Layer between Hard Adherends, Proceedings of the 11th US-Japan Conference on Composite Materials, Adhe 3-1, pp. 1-4, 2004.

P32. Seiya Hagihara, Shinji Motoda, Mitsuyoshi Tsunori, Toru Ikeda and Noriyuki Miyazaki, Nodal Relocation Method Applied to Adaptive Analysis of Meshfree Mthod, Proceedings CD-ROM of 4th European Congress on Computational Methods in Applied Sciences and Engineering (ECCOMAS 2004), Jyväskylä Finland, 2004.

P31. Mitsuyoshi Tsunori, Seiya Hagihara, Akihiko Ebina, Shunji Kasa, Toru Ikeda and Noriyuki Miyazaki, Calculation of Mixed-Mode Stress Intensity Factors for Crack Propagation using Element-Free Galerkin Method, Proceedings CD-ROM of 4th European Congress on Computational Methods in Applied Sciences and Engineering (ECCOMAS 2004), Jyväskylä Finland, 2004.

P30. Toru Ikeda, Koh Yamanaga, Masaki Nagai and Noriyuki Miyazaki, Stress Intensity Factors Analysis of an Interface Crack between Anisotropic Dissimilar Materials under Thermal Stress, Proceedings CD-ROM of 4th European Congress on Computational Methods in Applied Sciences and Engineering (ECCOMAS 2004), Jyväskylä Finland, 2004.

P29. Masaaki Koganemaru, Toru Ikeda, Eisuke Mori and Noriyuki Miyazaki, Evaluation of Residual Stress in Resin Molding IC Chips using FEM, Proceedings of International Conference on Electronics Packaging (ICEP 2004), Tokyo, 2004, pp. 223-226.

P28. Toru Ikeda, Won-Keun Kim, Masaki Nagai and Noriyuki Miyazaki, Reliability Evaluation of Interconnection using Anisotropic Conductive Adhesive Films, Proceedings of 5th International Conference on Electronics Materials and Packaging (EMAP 2003), Singapore, 2003, pp. 190-195.

P27. Toru Ikeda, Koh Yamanaga and Noriyuki Miyazaki, Stress Intensity Factor Analyses of Interface Cracks between Anisotropic Media in Electronic Packages, Proceedings of InterPACK 2003, IPACK2003-35146, Maui, 2003, pp. 1-8.

P26. Won-Keun Kim, Toru Ikeda, Noriyuki Miyazaki, Reliability Evaluation of Flip Chip using Stress Intensity Factors of an Interface Crack, Proceedings of InterPACK 2003, IPACK2003-35093, 2003, pp. 1-7.

P25. Toru Ikeda, Junji Mano, Deok-bo Lee and Noriyuki Miyazaki, Damage of Rubber-Modified Epoxy Resin in an Adhesive Layer Constrained by Hard Adherends, Extended Abstracts of Deformation of Yield and Fracture of Polymers 12th International Conference, Maui, 2003, pp. 29-32.

P24. Seiya Hagihara, Mitsuyoshi Tunori, Toru Ikeda, Noriyuki Miyazaki, Takayuki Watanabe and Chunrong Jin, Meshless Analysis Integrated System for Structural and Fracture Mechanics Analysis, Advances in Meshfree and X-FEM Methods, pp. 63-68.

P23. Toru Ikeda, Deok-bo Lee, Junji Mano, Noriyuki Miyazaki and Nak-Sam Choi, Damage Mechanism of Rubber-Tougheded Epoxy Resin around a Crack in Thin Adhesive Layer Constrained by Hard Adherends, Proceedings of the American Society for Composites: Seventeenth Technical Conference, 2002, pp. 107-115.

P22. Seiya Hagihara, Mitsuyoshi Tsunori, Toru Ikeda, Noriyuki Miyazaki, Takayuki Watanabe and Chunrong Jin, Meshless Analysis System of Elastic-Plastic and Fracture Mechanics Problem, International Conference on Computational Engineering Sciences (ICES'02), 2002, Paper ID: 87

P21. Seiya Hagihara, Mitsuyoshi Tsunori, Toru Ikeda and Noriyuki Miyazaki, Error Estimation for Adaptive EFGM Analysis, Fifth World Congress on Computational Mechanics, Paper-ID: 80322, http://wccm.tuwien.ac.at/, 2002, pp. 1-9.

P20. Toru Ikeda, Junji Mano, Daisuke Ikemoto, Deok-bo Lee and Noriyuki Miyazaki, Damage Analysis around a Crack Tip in Thin Adhesive Layer, Fifth World Congress on Computational Mechanics, Paper-ID: 80745, http://wccm.tuwien.ac.at/, 2002, pp. 1-10.

P19. Toru Ikeda, Daisuke Ikemoto, Deok-bo Lee and Noriyuki Miyazaki, Damage Mechanics in Thin Adhesive Layer Constrained by Hard Adherends, Computational Mechanics: New Frontiers for the New Millennium, Vol. 1, 2001, pp.631-636.

P18. Seiya Hagihara, Mitsuyoshi Tunori, Toru Ikeda and Noriyuki Miyazaki, Calculation of Dynamic Fracture Mechanics Parameter Using the Element Free Galerkin Method, Computational Mechanics: New Frontiers for the New Millennium, Vol. 1, 2001, pp.625-630.

P17. Toru Ikeda, Noriyuki Miyazaki, Yuya UENO, Nobutaka Ito, Design for Plastic Packages of LSI Chip to Prevent Cracking during solder Reflow Process, Proceedings of the InterPACK 2001, IPACK2001-15611, 2001, pp. 1-10.

P16. Tour Ikeda, Tomohiro Tokunaga, Deok-bo Lee, Noriyuki Miyazaki, Mitsugu Todo, Kiyoshi Takahashi and Nobutaka Ito, Effect of Rubber Content on the Fracture Toughness of ABS Resin, Materials Science Research International, Special Technical Publication - 2, 2001, pp. 177-182.

P15. Seiya Hagihara, Mitsuyoshi Tsunori, Toru Ikeda, Noriyuki Miyazaki, Analysis of Fracture Mechanics Parameters for Stable Crack Growth Problems Using Elastic-Plastic Element-Free Galerkin Method, Advances in Computational Engineering & Sciences, (proceedings of ICES ) Vol. I, 2000, pp.1953-1960.

P14. T. Ikeda and C. T. Sun, Stress Intensity Factor Analysis for an Interface Crack between Dissimilar Isotropic Materials under Thermal Stress, Damage and Fracture Mechanics VI, 2000, pp.63-72.

P13. Seiya Hagihara, Mitsuyoshi Tsunori, Toru Ikeda and Noriyuki Miyazaki, Element-Free Galerkin Method Applied to Creep Crack Propagation Problems, Computational Mechanics for the Next Millennium (Proceedings of APCOM '99), Vol.2, 1999, pp.997-1002.

P12. Seiya Hagihara, Mitsuyoshi Tsunori, Toru Ikeda, Tomohiro Kido and Noriyuki Miyazaki, Application of Element-Free Galerkin Method to Elastic-Plastic Problem, Computational Mechanics for the Next Millennium (Proceedings of APCOM '99), Vol. 2, 1999, pp. 967-972.

P11. Toru Ikeda, Isao Arase, Yuya Ueno, Noriyuki Miyazaki, Nobutaka Ito, Mami Nagatake and Mitsuru Sato, Strength Evaluation of Plastic Packages during Solder Reflow Process Using Stress Intensity Factors of V-Notch, ASME EEP, Vol. 26-2, 1999, pp. 1741-1748.

P10. Deok bo Lee, Toru Ikeda, Mitsugu Todo, Noriyuki Miyazaki and Kiyoshi Takahashi, The Mechanism of Damage around Crack Tip in Rubber Modified Epoxy Resin, ACCM-1, The First Asian-Australian Conference on Composite Materials, Vol. II, 1998, pp. 705.1-705.4.

P9. Toru Ikeda, Isao Arase, Yuya Ueno and Noriyuki Miyazaki, Strength Evaluation of V-notches in Electronic Plastic Packaging Using Stress Intensity Factor of V-Notch, Modeling and Simulation Based Engineering, Vol. I, 1998, pp. 965-970.

P8. Seiya Hagihara, Mitsuyoshi Tsunori, Toru Ikeda, Noriyuki Miyazaki and Michihiko Nakagaki, Method of Searching Nodes Using Directed Graph for Element Free Galerkin Method and its Application to Creep Nonlinear Problem, Modeling and Simulation Based Engineering, Vol. I, 1998, pp. 65-70.

P7. Toru Ikeda, Keiji Gondo and Noriyuki Miyazaki, Constraint Effect of Adherends on Stress Field near an Interface Crack Tip between an Adhesive Layer and an Adherend, Proceeding of the 5th Japan Int. SAMPE Symp., 1997, pp. 777-782.

P6. Toru Ikeda, Yuji Komohara and Noriyuki Miyazaki, Measurement of Mixed Mode Fracture Toughness of an Interface Crack in Electronic Devises, Advances in Electronic Packaging, ASME EEP-Vol. 19-2, 1997, pp. 1137-1444.

P5. Toru Ikeda, Noriyuki Miyazaki, Kiyoteru Kudo and Tsuyoshi Munakata, Damage Analysis of Semiconductor Chip during Wire Bonding Process, Computational Mechanics '95 Vol. 1, 1995, pp. 616-621.

P4. Miyazaki Miyazaki, Toru Ikeda and Kenichi Ochi, Constraint Effect of Clad on Underclad Crack, PVP-Vol. 304, 1995, pp. 313-318.

P3. Toru Ikeda, Noriyuki Miyazaki, Akira Yamashita and Tsuyoshi Munakata, Elastic-Plastic Analysis of Crack in Ductile Adhesive Joint, Composites for the Pressure Vessel Industry, ASME PVP-Vol. 302, 1995, pp. 155-162.

P2. Toru Ikeda, Noriyuki Miyazaki, Toshihiro Soda and Tsuyoshi Munakata, Mixed Mode Fracture Criteria of Interface Crack between Dissimilar Materials, Pressure Vessel Integrity, ASME PVP-Vol. 250, 1993, pp. 143-150.

P1. Noriyuki Miyazaki, Toru Ikeda and Tsuyoshi Munakata, Stress Intensity Factor Analysis by Combination of Boundary Element and Finite Element Methods (Application to Axisymmetric Crack Problems), Boundary Elements XII, Computational Mechanics Publications., Vol.1, 1990, pp. 255-266.